图片仅供参考,产品以实物为准
| 规格书 |
 5175475 CHAMP Series I Appl Spec |
| 文档 |
6-5175475-1 Statement of Compliance RoHS 2 Statement 6-5175475-1.stp 6-5175475-1.pdf 6-5175475-1.igs |
| 三维模型 | View |
| Connector Style | Outer Shroud Contacts |
| Connector Type | Receptacle |
| Contact Finish Thickness | 30µin (0.76µm) |
| Contact Finish | Gold |
| Features | Board Lock |
| Mounting Type | Through Hole |
| Number of Positions | 120 |
| Number of Rows | 2 |
| Termination | Solder |
| Type | Board to Board, High Density |
| 类型 | SCSI |
| 性别 | RCP |
| 间距 | 1.27 mm |
| 端接方式 | Solder |
| 安装 | Through Hole |
| 身体上的取向 | Straight |
| 标准包装 | Trays |
| PCB极化 | Without |
| PCB安装角度 | Vertical |
| 固定支脚材质 | Brass |
| 外壳材料 | Nylon |
| PCB安装方式 | Thru Hole |
| 位置数 | 120 |
| 简介 | Standard |
| Lead Free Solder Processes | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| 产品系列 | Series I |
| 间距（mm （中） ） | 1.27 [0.050] |
| 品牌 | AMP |
| 产品类型 | Connector |
| RoHSELV合规性 | RoHS compliant, ELV compliant |
| PCB保持力特性 | Yes |
| 连接器类型 | High Density (HD) |
| 外壳温度等级 | Standard |
| 触点区域镀层材料 | Gold (30) |
| PCB保持力的方法 | Boardlock(s) |
| 壳体防火等级 | UL 94V-0 |
| 封底 | Without |
| 颜色 | Black |
| 固定支脚镀层 | Tin over Nickel |
| 用于 | Board To Board Applications |
| 触点材料 | Phosphor Bronze |
| RoHSELV符合记录 | Always was RoHS compliant |
| 终止（焊接）长度（mm （英寸） ） | 3.10 [0.122] |
| 产品特点 | Board Lock |
| 安装类型 | Through Hole |
| 触点表面涂层 | Gold |
| 行数 | 2 |
| 端子 | Solder |
| Contact Finish Thickness | 30µin (0.76µm) |
| 连接器类型 | Outer Shroud Contacts |
| RoHS指令 | Lead free / RoHS Compliant |
| RoHS | RoHS Compliant |
| 标准包装 | 50 |
| mating | 6-5175473-1 4-5175472-1 6-5175472-1 |
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